reflow oven ERSA HOTFLOW 2/20

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Manufacturer: ERSA

Model:HOTFLOW 2/20

Type of machine: reflow oven

item-No.: 168817928

Quantity: 1

Date: 29.05.2026

Year of manufacture: 2007

Location: Land-pl Poland

Price: 21,250 EUR

ERSA HOTFLOW 2/20 reflow oven was built in 2007 in Germany by ERSA GmbH. It is a specialist machine dedicated to reflow soldering, one of the basic soldering techniques in high-volume production of electronic components. Electronic components are joined to the printed circuit board PCB by means of solder paste, which is melted at a controlled temperature. This results in extremely durable and precise connections, which is crucial in the production of modern electronic devices.

ERSA HOTFLOW 2/20 sets the highest standards in lead free reflow soldering. It allows the soldering of all, even the most thermally sensitive components on printed circuit boards PCB with a maximum width of 510 mm. The workspace consists of 20 separately controlled heating zones and 3 cooling zones with precise temperature control, which provide maximum flexibility in terms of soldering profile configuration. The HOTFLOW 2/20 reflow soldering machine also features, among others, a conveyor, an extraction system and a control system with ERSAsoft software. The total weight of the machine is approximately 2700 kg.

Technical specifications of the ERSA HOTFLOW 2/20 reflow soldering system
General data
- PCB printed circuit board width: 50-510 mm
- PCB printed circuit board minimum length: 100 mm
- PCB printed circuit board clearance: +35/-25 mm
- work space dimensions (L x W): 4840 x 700 mm
- length of infeed zone: 700 mm
- length of outfeed zone: 700 mm
- conveyor speed: 20-200 cm/min
- distance from floor to conveyor surface: 820-850 mm
- gas flow (nitrogen): 0-30 m3/h
- gas injection (nitrogen): in the soldering zone
- extraction system capacity: 2x 400 m3/h
- compressed air connection: 6-8 bar
- nitrogen connection: 6-10 bar
- maximum ambient temperature: 30°C
- noise level: <64 dB(A)
- power: 80.5 kW
- power supply: 3x 400 V; 50/60 Hz
- dimensions (L x W x H): 6240 x 1500 x 1370 mm
- weight of the ERSA HOTFLOW 2/20 machine: approx. 2700 kg

Heating zones
- number of heating zones: 10x top/bottom, of which:
preheating zones: 7x top/ 7x bottom
soldering zones: 3x top/ 3x bottom
- total length of heating zone: 3620 mm
- gas flow per zone: adjustable, up to 500 m3/h

Cooling zones
- number of cooling zones: 3x top/bottom
- total length of cooling zone: 1200 mm
- coolant: water/air

Equipment of the ERSA reflow oven
- control system with ERSAsoft software
- process atmosphere monitoring per zone (1 pc.)
- process atmosphere cleaning in cooling zone
- adjustment of fan speed in heating and cooling zones
- conveyor
- push-button for adjusting the conveyor width
- automatic lubrication of conveyor and central support
- main switch (1 pc.)
- emergency stop button (4 pcs.)
- lamp indicating machine status
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ERSA HOTFLOW 2/20 reflow oven was built in 2007 in Germany by ERSA GmbH. It is a specialist machine dedicated to reflow soldering, one of the basic soldering techniques in high-volume production of electronic components. Electronic components are joined to the printed circuit board PCB by means of solder paste, which is melted at a controlled temperature. This results in extremely durable and precise connections, which is crucial in the production of modern electronic devices.

ERSA HOTFLOW 2/20 sets the highest standards in lead free reflow soldering. It allows the soldering of all, even the most thermally sensitive components on printed circuit boards PCB with a maximum width of 510 mm. The workspace consists of 20 separately controlled heating zones and 3 cooling zones with precise temperature control, which provide maximum flexibility in terms of soldering profile configuration. The HOTFLOW 2/20 reflow soldering machine also features, among others, a conveyor, an extraction system and a control system with ERSAsoft software. The total weight of the machine is approximately 2700 kg.

Technical specifications of the ERSA HOTFLOW 2/20 reflow soldering system
General data
- PCB printed circuit board width: 50-510 mm
- PCB printed circuit board minimum length: 100 mm
- PCB printed circuit board clearance: +35/-25 mm
- work space dimensions (L x W): 4840 x 700 mm
- length of infeed zone: 700 mm
- length of outfeed zone: 700 mm
- conveyor speed: 20-200 cm/min
- distance from floor to conveyor surface: 820-850 mm
- gas flow (nitrogen): 0-30 m3/h
- gas injection (nitrogen): in the soldering zone
- extraction system capacity: 2x 400 m3/h
- compressed air connection: 6-8 bar
- nitrogen connection: 6-10 bar
- maximum ambient temperature: 30°C
- noise level: <64 dB(A)
- power: 80.5 kW
- power supply: 3x 400 V; 50/60 Hz
- dimensions (L x W x H): 6240 x 1500 x 1370 mm
- weight of the ERSA HOTFLOW 2/20 machine: approx. 2700 kg

Heating zones
- number of heating zones: 10x top/bottom, of which:
preheating zones: 7x top/ 7x bottom
soldering zones: 3x top/ 3x bottom
- total length of heating zone: 3620 mm
- gas flow per zone: adjustable, up to 500 m3/h

Cooling zones
- number of cooling zones: 3x top/bottom
- total length of cooling zone: 1200 mm
- coolant: water/air

Equipment of the ERSA reflow oven
- control system with ERSAsoft software
- process atmosphere monitoring per zone (1 pc.)
- process atmosphere cleaning in cooling zone
- adjustment of fan speed in heating and cooling zones
- conveyor
- push-button for adjusting the conveyor width
- automatic lubrication of conveyor and central support
- main switch (1 pc.)
- emergency stop button (4 pcs.)
- lamp indicating machine status
seller offer No. resale 168817928
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Price: sold ERSA HOTFLOW 2/20 + similar ERSA-Model

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