Cleveland TKET-6-T İkiz pişirme su ısıtıcısı 2009, paslanmaz, buhar ceketli ikiz kaplar, 2 x 25L kaplar, ayarlanabilir sıcaklık kontrolleri, 3Ph
Cleveland KGL40 su ısıtıcısı paslanmaz, 40 galon, ceketli pişirme su ısıtıcısı, ayarlanabilir sıcaklık kontrolleri, buhar ceketli, 1Ph
Üretici firma: Cleveland Modeli: GAPU-5 A/M Elmas Diskler: - Maksimum Çap: 200 mm - Minimum Çap: 180 mm - Maksimum Genişlik (çift diskli): 100 mm Not: Ürünle birlikte verilen taşlama taşı koruması, maksimum 200 mm çap ve minimum 180 mm çap için tasarlanmıştır. İş Parçası Mili: - Hız Aralığı: 400 – 4500 rpm Planya Ünitesi: - Dönme Aralığı: 190 - Salınım İnme: 70 mm - Salınım Hızı: Kademesiz ayarlanabilir - İş Mili Hızı: 1400 veya 2800 rpm Planya Taşlama Diski: - Çap: 200 mm - Genişlik: 20 mm - Delik Çapı: 32 mm Makine Ölçüleri: - Uzunluk: 1250 mm -
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system, image field 20 x 16 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii etc. DXF files., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter ...
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clampi ...
