Electroplating test system for high flow / separation
It does not have a control/transport cart and has not yet been used.
That was our model system.
It is a separator bath with 3 positions
The positions are designed for vertical and horizontal arrival
including a 25mm movement of goods.
The buyer can view the system, and also dismantle it.
High-performance test containers for ViaFill and AR 1:40
Features:
- Aspect ratio up to 1:40
- Multifunctional system for panel & pattern plating, blind micro via
plating, via filling plating, button and bridge plating
- Suitable for flex circuit substrates up to 6.2 mm thick
- Segmented anodes with 3 inert anodes per PCB
- 372 slots for eductors with horizontal flow per PCB
- Two-dimensional fabric movement in the copper cell
The copper cell: Our copper cell is designed for PCBs from 18" x 25"
to 21" x 24". Hydrodynamic conditions are guaranteed by innovative
anode boxes. Each side offers 372 slots for eductors with horizontal
flow. Segmented anodes adapt flexibly to different PCB formats.
Segmented reverse U5758834 pulse or direct current rectifiers as an
example:
- 2 pieces 80A and 106A effective, reverse pulse ratio 1:3
- 1 piece 40A and 53A effective, reverse pulse ratio 1:3
- Possibility to connect the 3 segments in parallel
- Separate control for front and rear
Versatile fabric movement: Two dimensional movements, adjustable
stroke directions and a lateral jogger for the fabric carrier offer
flexibility for various applications.
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