测试系统 LUDY Electroplating test system

电气部件 / 电气部件

生产厂家: LUDY

型号:Electroplating test system

机械类型: 测试系统

产品编号: 166201126

数量: 1

日期: 17.07.2025

设备所在地: Frankfurt, Germany

价格:


Seller-item-No.:5287266

Electroplating test system for high flow / separation

It does not have a control/transport cart and has not yet been used. That was our model system.

It is a separator bath with 3 positions

The positions are designed for vertical and horizontal arrival including a 25mm movement of goods.

The buyer can view the system, and also dismantle it.

High-performance test containers for ViaFill and AR 1:40

Features:

- Aspect ratio up to 1:40

- Multifunctional system for panel & pattern plating, blind micro via plating, via filling plating, button and bridge plating

- Suitable for flex circuit substrates up to 6.2 mm thick

- Segmented anodes with 3 inert anodes per PCB

- 372 slots for eductors with horizontal flow per PCB

- Two-dimensional fabric movement in the copper cell

The copper cell: Our copper cell is designed for PCBs from 18" x 25" to 21" x 24". Hydrodynamic conditions are guaranteed by innovative anode boxes. Each side offers 372 slots for eductors with horizontal flow. Segmented anodes adapt flexibly to different PCB formats.

Segmented reverse U5758834 pulse or direct current rectifiers as an example:

- 2 pieces 80A and 106A effective, reverse pulse ratio 1:3

- 1 piece 40A and 53A effective, reverse pulse ratio 1:3

- Possibility to connect the 3 segments in parallel

- Separate control for front and rear

Versatile fabric movement: Two dimensional movements, adjustable stroke directions and a lateral jogger for the fabric carrier offer flexibility for various applications.

Find more here - /

Contact us at -
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Electroplating test system for high flow / separation

It does not have a control/transport cart and has not yet been used. That was our model system.

It is a separator bath with 3 positions

The positions are designed for vertical and horizontal arrival including a 25mm movement of goods.

The buyer can view the system, and also dismantle it.

High-performance test containers for ViaFill and AR 1:40

Features:

- Aspect ratio up to 1:40

- Multifunctional system for panel & pattern plating, blind micro via plating, via filling plating, button and bridge plating

- Suitable for flex circuit substrates up to 6.2 mm thick

- Segmented anodes with 3 inert anodes per PCB

- 372 slots for eductors with horizontal flow per PCB

- Two-dimensional fabric movement in the copper cell

The copper cell: Our copper cell is designed for PCBs from 18" x 25" to 21" x 24". Hydrodynamic conditions are guaranteed by innovative anode boxes. Each side offers 372 slots for eductors with horizontal flow. Segmented anodes adapt flexibly to different PCB formats.

Segmented reverse U5758834 pulse or direct current U5758834 rectifiers as an example:

- 2 pieces 80A and 106A effective, reverse pulse ratio 1:3

- 1 piece 40A and 53A effective, reverse pulse ratio 1:3

- Possibility to connect the 3 segments in parallel

- Separate control for front and rear

Versatile fabric movement: Two dimensional movements, adjustable stroke directions and a lateral jogger for the fabric carrier offer flexibility for various applications.

Find more here - /

Contact us at -
seller offer No. resale 5287266
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卖家

logo dealer

UCY Industrial GmbH

Mr Nick Breinfalk
82049 Pullach
Germany

RESALE 会员 开始年份 2024

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