Based on the nameplate you provided and the technical data for the
S3088 SPI (Solder Paste Inspection) variant, here are the key
specifications for your machine:
PCs replaced in 2024 to new ones
Core Inspection Capabilities
The S3088 SPI is a specialized high-performance system designed to
detect printing defects immediately after the stencil printer.
- Inspection Scope: Analyzes solder paste deposits for volume, height,
form, area, displacement (X/Y offset), and smearing.
- Component Compatibility: Capable of inspecting demanding assemblies
with CSPs, micro BGAs, and pad sizes down to 01005.
- 3D Technology: Uses a fringe projection process for precise 3D
height and volume measurement.
- Inspection Speed: Up to 80 cm²/s (depending on resolution
settings).
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Technical Specifications (from your Nameplate & Records)
FeatureDetailsTypeS3088 SPI (Serial No. 102688)Year of
Manufacture09/2014ResolutionUp to 15 µm/pixel
(lateral)Z-ResolutionTypically 0.1 µm or 0.5 µm for height
measurementMax PCB Size$508\text{ mm} \times 508\text{ mm}$
(standard)Positioning UnitSynchronous linear motors for high-speed
accuracyPower Consumption1.2 kW (at 230/400V)Weight700 kg
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