Cleveland TKET-6-T Hervidor de cocina doble 2009, acero inoxidable, recipientes gemelos con camisa de vapor, 2 recipientes de 25 L, controles de temperatura ajustables, 3Ph
Hervidor Cleveland KGL40 inoxidable, 40 galones, hervidor de cocina encamisado, controles de temperatura ajustables, camisa de vapor, 1Ph
Fabricante: Cleveland Modelo: GAPU-5 A/M Discos de diamante: - Diámetro máximo: 200 mm - Diámetro mínimo: 180 mm - Anchura máxima (con doble disco): 100 mm Nota: El protector de muela abrasiva suministrado está diseñado para un diámetro máximo de 200 mm y un diámetro mínimo de 180 mm. Husillo de la pieza de trabajo: - Rango de velocidad: 400 – 4500 rpm Unidad de cepillado: - Rango de giro: 190 - Carrera de oscilación: 70 mm - Velocidad de oscilación: Infinitamente ajustable - Velocidad del husillo: 1400 o 2800 rpm Disco abrasivo de cepillado: - Diámetro: 200 mm - Ancho: 20 mm - Diámetro del orificio: 32 mm Dimensiones de la máquina: - Longitud: 1250 mm -
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system, image field 20 x 16 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii etc. DXF files., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter ...
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clampi ...
