製造元:VISCOM モデル:S3088 III 製造年:2011年 体重:750kg Viscomによる最終年次メンテナンス:2025年6月23日 積み下ろし機の場合: - 製造元:ASYS - タイプ:AES 03DK - 製造年:05/11 - 重量:335kg 詳細はこちらをご覧ください - / お問い合わせはこちらまで -
Based on the nameplate you provided and the technical data for the S3088 SPI (Solder Paste Inspection) variant, here are the key specifications for your machine: PCs replaced in 2024 to new ones Core Inspection Capabilities The S3088 SPI is a specialized high-performance system designed to detect printing defects immediately after the stencil printer. - Inspection Scope: Analyzes solder paste deposits for volume, height, form, area, displacement (X/Y offset), and smearing. - Component Compatibility: Capable of inspecting demanding assemblies with CSPs, micro BGAs, and pad sizes down to 01005. - 3D Technology: Uses a fringe projection process for precise 3D height and volume measurement. - Inspection Speed: Up to 80 cm²/s (depending on resolution settings). --------------------------------------------------------------- Technical Specifications (from your Nameplate & Records) Featu ...
The Viscom S3088 ultra gold is a high-performance 3D Automated Optical Inspection (AOI) system designed for high-volume electronics manufacturing that requires maximum throughput and precision. PCs replaced in 2024 to new ones Top Performance Specs - Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands. - 3D Sensor Technology: Powered by the XMplus high-performance camera module. - Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection. - Image Field Size: $50\text{ mm} \times 50\text{ mm}$. - Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis). --------------------------------------------------------------- Key Technical Capabilities - Component Range: Reliably inspects the latest miniaturized generations, including 03015 components. - Defect Detection ...
