Manufacturer: Samco
Model: FlexLiner II
Year of Manufacture: 2018
Type of Machine : UCP plasma machine
The samco-ucp FlexLiner II is a production type plasma cleaning system
designed for surface cleaning of various types of leadframe packages.
This system operates with a remote plasma source in the downstream
process mode. The plasma is generated by RF power in the source and
then injected into the process chamber through a shower head.
Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)
Key Features and Benefits
- Single substrate production equipment for various types and
dimensions of substrates and magazines up to 300 mm x 300 mm
- Gentle handling with minimal movement of substrates and magazines
- Touchscreen GUI for user-friendly, intuitive operation
- Multiple sensor controls for highly reliable operation
- High throughput due to simultaneous (un)loading and plasma
processing
- Typical process gases Ar, H2 and N2 for optimum surface activation
and soft chemical removal
Applications
- Surface cleaning of metal leadframes, plastic microelectronic
packages, MEMS or micro-optic packages, hybrid or multi-chip
modules
- Surface treatment for improvement of gluing, bonding or
encapsulation
- Mainly surface activation and removal of oxides or organic
residues
- Optimum plasma processing for a variety of materials in
semiconductor technology
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