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Samco FlexLiner II Системи обробки поверхні
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Технічні характеристики
· ID 168890056Машини
- Стан
- вживаний
- Рік випуску
- 2018
- Місцезнаходження
- Nuremberg, Germany
Identifikation
ВиробникSamco
МодельFlexLiner II
Номер позиції8624655
Technik
Кількість1
Опис
Manufacturer: Samco
Model: FlexLiner II
Year of Manufacture: 2018
Type of Machine : UCP plasma machine
The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head. Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)
Key Features and Benefits
- Single substrate production equipment for various types and dimensions of substrates and magazines up to 300 mm x 300 mm
- Gentle handling with minimal movement of substrates and magazines
- Touchscreen GUI for user-friendly, intuitive operation
- Multiple sensor controls for highly reliable operation
- High throughput due to simultaneous (un)loading and plasma processing
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Applications
- Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology
Find more here - .ucymachines/
Contact us at - sales@ucymachines
Model: FlexLiner II
Year of Manufacture: 2018
Type of Machine : UCP plasma machine
The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head. Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)
Key Features and Benefits
- Single substrate production equipment for various types and dimensions of substrates and magazines up to 300 mm x 300 mm
- Gentle handling with minimal movement of substrates and magazines
- Touchscreen GUI for user-friendly, intuitive operation
- Multiple sensor controls for highly reliable operation
- High throughput due to simultaneous (un)loading and plasma processing
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Applications
- Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology
Find more here - .ucymachines/
Contact us at - sales@ucymachines
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