AOI Systems SAKI 3Di-LS2 18um

технологічні процеси / машини та установки для технологічних процесів

Виробник: SAKI

Модель:3Di-LS2 18um

Тип техніки: AOI Systems

Номер позиції: 170120013

Кількість: 1

Дата: 31.08.2026

Рік випуску: 2023

Місцезнаходження: Stuttgart, Germany

Ціна:


Seller-item-No.:9456929

Manufacturer: SAKI

Model: 3Di-LS2 18um

Type of Machine: 3D AOI System

Year of Manufacture : 2023

Configuration: High-speed single-lane system, without side cameras

Technology: Highly accurate and repeatable 3D measurement technology with digital 4-way stripe projection and telecentric camera technology

Process Linking: Process linking with SAKI SPI systems

Technical Specifications:

- Resolution 18um in X/Y direction, 1um in Z direction
- Printed circuit board format 50x60mm to 500x510mm
- PCB thickness 0.6 to 5.2mm
- PCB clearance top/bottom 40/60mm
- PCB deflection +/- 2mm
- Image acquisition time: 5700 mm2/s
- 4-way projection with multidirectional ring light
- Conveyor belt height: 880 - 965 mm
- Dimensions 1040x1440x1500mm (WxHxD)
- Weight: approx. 900 kg
- Power supply ~200-240V +/-10%, 50/60Hz
- Compressed air 0.5MPa, 5l/min (ANR)
- Automatic transport width adjustment
- Operating system Windows 10
- CE conformity

Available Additional Equipment:

- Side camera option (demo system) - Four side cameras for inspecting areas of the circuit boards that the orthogonal camera cannot access
- BF2 Editor SW License - Offline programming station including software, excluding PC hardware
- BF2 Monitor SW License - Offline repair station including software, basic SPC functions
- BF2 Editor PC Hardware - Offline programming station PC hardware
- BF2 Monitor PC Hardware - Offline repair station for PC hardware

Find more here - .ucymachines/

Contact us at - sales@ucymachines
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Manufacturer: SAKI

Model: 3Di-LS2 18um

Type of Machine: 3D AOI System

Year of Manufacture : 2023

Configuration: High-speed single-lane system, without side cameras

Technology: Highly accurate and repeatable 3D measurement technology with digital 4-way stripe projection and telecentric camera technology

Process Linking: Process linking with SAKI SPI systems

Technical Specifications:

- Resolution 18um in X/Y direction, 1um in Z direction
- Printed circuit board format 50x60mm to 500x510mm
- PCB thickness 0.6 to 5.2mm
- PCB clearance top/bottom 40/60mm
- PCB deflection +/- 2mm
- Image acquisition time: 5700 mm2/s
- 4-way projection with multidirectional ring light
- Conveyor belt height: 880 - 965 mm
- Dimensions 1040x1440x1500mm (WxHxD)
- Weight: approx. 900 kg
- Power supply ~200-240V +/-10%, 50/60Hz
- Compressed air 0.5MPa, 5l/min (ANR)
- Automatic transport width adjustment
- Operating system Windows 10
- CE conformity

Available Additional Equipment:

- Side camera option (demo system) - Four side cameras for inspecting areas of the circuit boards that the orthogonal camera cannot access
- BF2 Editor SW License - Offline programming station including software, excluding PC hardware
- BF2 Monitor SW License - Offline repair station including software, basic SPC functions
- BF2 Editor PC Hardware - Offline programming station PC hardware
- BF2 Monitor PC Hardware - Offline repair station for PC hardware

Find more here - .ucymachines/

Contact us at - sales@ucymachines
seller offer No. resale 9456929
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Продавець

logo dealer

UCY Industrial GmbH

пан Nick Breinfalk
82049 Pullach
Germany

RESALE член з 2024

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