Suitable for dressing and profiling diamond and CBN grinding wheels
using silicon carbide wheels (individually or in a package).,
Accessories:, Total enclosure,, Camera system, image field 20 x 16 mm,
Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package
dressing, Software for converting DXF files to CNC files on PC,
Touchscreen, Standard software for straight, bevel or radii etc. DXF
files., Single Diamond- / CBN grinding wheel diameter: 400 mm,
Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width
150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees,
Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting
diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon
wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece
clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece
spindle head holder diameter : 100 mm, with belt spindle diameter :
100 x 200 mm, Grinding wheel balance: max. 40 kg, Workpiece spindle
speed: 500 - 1500 rpm, SIC discs up to max.: 200 x 20 mm x 32 mm,
Connected load: approx. 2.5 kW (400 Volts / 50 Hz), Dimensions W x D x
H: 2000 x 2000 x 2600 mm, weight: 1200 kg, colour: red RAL 3003 /
grey RAL 7035
독일
cloppenburg 
