클리블랜드 TKET-6-T 트윈 쿠킹 케틀 2009, 스테인리스, 스팀 재킷 트윈 vessels, 2 x 25L vessels, 조절식 온도 조절, 3Ph
제조사: 클리블랜드 모델: GAPU-5 A/M 다이아몬드 디스크: - 최대 직경: 200mm - 최소 직경: 180mm - 최대 너비 (더블 디스크 포함) : 100mm 참고: 제공된 연삭 휠 가드는 최대 직경 200mm, 최소 직경 180mm로 설계되었습니다. 공작물 스핀들: - 속도 범위: 400 – 4500rpm 대패 단위: - 스위블 범위: 190 - 진동 스트로크 : 70mm - 진동 속도 : 무한 조정 가능 - 스핀들 속도 : 1400 또는 2800 rpm 기획 연삭 디스크: - 직경: 200mm - 너비: 20mm - 보어 직경: 32mm 기계 치수: - 길이 : 1250mm -
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system, image field 20 x 16 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii etc. DXF files., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter ...
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clampi ...
