Suitable for dressing and profiling diamond and CBN grinding wheels
using silicon carbide wheels., Accessories:, Total enclosure,, Camera
system with 7x motorized zoom video system, plus 10x digital zoom,
Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package
dressing, Grinding spindle SK 40, Grinding wheel guard, swivels to the
rear, Software for converting DXF files to CNC files on PC,
Single-disc width: 30 mm, Swivel axis: swivel plate for swivel angle:
+/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm,
Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm,
Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm
Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm,
Workpiece spindle head holder diameter : 100 mm, with belt spindle
diameter : 100 x 200 mm, Grinding wheel balance: max. 40 kg, Workpiece
spindle speed: 500 - 1500 rpm, SIC discs up to max.: 200 x 20 mm x 32
mm, Connected load: approx. 2.5 kW (400 Volts / 50 Hz), Dimensions W x
D x H: 2700 x 2200 x 2200 mm, colour: Grey , weight: 1900 kg, Diamond-
/ CBN grinding wheel diameter: 400 mm
독일
cloppenburg 
