Manufacturer: KOKI TEC
Model: SELBO III 5051
Type: Inline selective soldering machine
Specifications
- Outer dimensions: 3,236 (L) x 1,577 (W) x 1,300 (H) mm
- Minimum PCB size: 100 (W) x 100 (L) mm
- Maximum PCB size: 500 (W) x 510 (L) mm
- PCB thickness: 0.8 to 2.0 mm
- Maximum component height: top side 110 mm or less, bottom side 25 mm
or less
- Program steps: 400 steps, 100 files
- Nozzle diameter: inner diameter 2 to 20 mm
- Solder capacity: approx. 16 kg (specific gravity 7.3)
- Nitrogen supply: 0.5 MPa, 25 L/min per pod
- Air supply: 0.4 to 0.5 MPa
- Power source: 3-phase AC 200V plus/minus 10 percent
- Power capacity: 2 kVA (fluxer) / 20 kVA (heater) / 6 kVA (solder
pot)
- Net weight: 450 kg (fluxer) / 390 kg (heater) / 480 kg (solder
pot)
Key Features
- Improved soldering quality with reduced solder defect rate
- Inline automation for labor savings in PCB assembly
- Modular structure allows layout changes and capacity expansion
- Maintenance can be performed on individual modules without stopping
production
- PCB warp correcting function to prevent nozzle contact
- Aero jet nozzle system for precise flux application
- Program creation system Freedom with movement path and tact balance
optimisation
- Supports MES, automatic changeover, and traceability
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