A Flying Probe Tester Seica Pilot V8 Next Series with inline handling
module on the left for vertical tilting of the PCB and inline handling
module on the right for horizontal tilting and rotating of the PCB is
available. Flying Probe Test System Seica Pilot V8 Next Series: PCB
clamping system: manual, double-acting, manual active test area:
538x610mm, active test area: 518x610mm, PCB dimensions: 540x610mm,
min. PCB size: 20x20mm, PCB thickness: 0.3 to 5mm, max. component
height: 37mm, PCB loading: vertical, UUT edge clearance
manual/automatic: 2/6mm, length: 1750mm, width: 1030mm, height:
1995mm, weight: 1.4t. Test tools/techniques: FNODE signature analysis
on the nets of the unit under test, standard analog and digital
in-circuit test, vectorless tests, JSCAN and OPENFIX to test ICs for
opens and shorts, PWMON net analysis with power-on of the assembly,
continuity tests to detect open connections on the assembly, visual
tests for detecting component presence, component absence and
rotation, high-resolution color camera, optional functional tests and
boundary scan test capabilities, optional on-board programming tools
for digital components, with complete documentation. An inspection on
site is possible.
德国
Deutschland 
