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Verbindungsanlage/ Bond Alignment System EVB 620 NT

automation equipment / other automation equipment

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Seller

Manufacturer: EVB

Model:620 NT

Type of machine: Verbindungsanlage/ Bond Alignment System

item-No.: 168123611

Quantity: 1

Date: 22.10.2025

Year of manufacture: 2022

Location: Land-de Germany

Auction Price: 85,000 EUR

Seller-item-No.:3

End of auction:

Verbindungsanlage/ Bond Alignment System
Make: EVB, Type: 620 NT, Year of manufacture: 2022, Serial number: S220193, Wafer alignment system, max. wafer size 150 mm, max. amplifier thickness 4.4 mm, with optical alignment module, underside microscope I51250783 and CCD camera as well as rack unit, NOTE: The system is as good as new and has not yet been used in production!
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Verbindungsanlage/ Bond Alignment System
Make: EVB, Type: 620 NT, Year of manufacture: 2022, Serial number: S220193, Wafer alignment system, max. wafer size 150 mm, max. amplifier thickness 4.4 mm, with optical alignment module, underside microscope I51250783 and CCD camera as I51250783 well as rack unit, NOTE: The system is as good as new and has not yet been used in production!
seller offer No. resale 3
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Indutax GmbH

Mr Ralf Haaken
40549 Düsseldorf
Germany

RESALE member since 2017


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