已验证经销商
查看详情
Viscom S3088 Ultra AOI系统
二手已验证卖家
询问价格
直接联系卖家
1 / 5
技术参数
· ID 168729211设备
- 状况
- 二手
- 出厂年份
- 2014
- 所在地
- Freiburg im Breisgau, Germany
Identifikation
制造商Viscom
型号S3088 Ultra
物品编号8523248
Technik
数量1
描述
The Viscom S3088 ultra gold is a high-performance 3D Automated Optical Inspection (AOI) system designed for high-volume electronics manufacturing that requires maximum throughput and precision.
PCs replaced in 2024 to new ones
Top Performance Specs
- Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands.
- 3D Sensor Technology: Powered by the XMplus high-performance camera module.
- Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection.
- Image Field Size: $50\text{ mm} \times 50\text{ mm}$.
- Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis).
---------------------------------------------------------------
Key Technical Capabilities
- Component Range: Reliably inspects the latest miniaturized generations, including 03015 components.
- Defect Detection: Advanced analysis for QFN, DFN, and QFP dewetting via angled views, as well as lifted leads and polarity errors.
- FastFlow Handling: Synchronous PCB transport allows for ultra-fast board changes in as little as 2.5 seconds.
- Software & AI: Supports vVision and EasyPro for intuitive operation and rapid program generation.
---------------------------------------------------------------
Hardware & Dimensions
FeatureSpecificationMax PCB Size$508\text{ mm} \times 508\text{ mm}$System Dimensions$997\text{ mm} \times 1600\text{ mm} \times 1540\text{ mm}$ ($B \times H \times T$)WeightMax. 800 kgPower/Air400 V; 3P/N/PE; 8 A; 4–6 bar working pressurePC SystemIntel Core i7 processor running on Windows
Find more here - .ucymachines/
Contact us at - sales@ucymachines
PCs replaced in 2024 to new ones
Top Performance Specs
- Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands.
- 3D Sensor Technology: Powered by the XMplus high-performance camera module.
- Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection.
- Image Field Size: $50\text{ mm} \times 50\text{ mm}$.
- Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis).
---------------------------------------------------------------
Key Technical Capabilities
- Component Range: Reliably inspects the latest miniaturized generations, including 03015 components.
- Defect Detection: Advanced analysis for QFN, DFN, and QFP dewetting via angled views, as well as lifted leads and polarity errors.
- FastFlow Handling: Synchronous PCB transport allows for ultra-fast board changes in as little as 2.5 seconds.
- Software & AI: Supports vVision and EasyPro for intuitive operation and rapid program generation.
---------------------------------------------------------------
Hardware & Dimensions
FeatureSpecificationMax PCB Size$508\text{ mm} \times 508\text{ mm}$System Dimensions$997\text{ mm} \times 1600\text{ mm} \times 1540\text{ mm}$ ($B \times H \times T$)WeightMax. 800 kgPower/Air400 V; 3P/N/PE; 8 A; 4–6 bar working pressurePC SystemIntel Core i7 processor running on Windows
Find more here - .ucymachines/
Contact us at - sales@ucymachines
询问此设备
您的询问将直接发送给此设备的卖家。
